Data sheet Product GS 66 P

gs66p_.eps
Thermal interface material / Fixing material / Mounting material>Thermal interface material>Mica wafers
TO 66, 18 x 13,5 mm, customer specific versions on request

Features

for transistor:
TO 66
material:
muskovit
material thickness:
0.05 mm
thermal resistance (GS 3):
0.4 K/W
dielectric strength:
5 kV
insulation resistance:
3·1017 Ω·cm

Technical Drawing

gs66p.eps