The leading manufacturer of heatsinks, thermal conductive materials, cases and connectors.
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Heatsinks for BGAs

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Heatsinks for BGAs

ICK BGA 14 x 14 x 14

14 x 14 x 14 mm, for IC design BGA and others
Price on application
Quantity
Add to inquiry
Features
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
14 mm
height:
14 mm
plate thickness:
2.5 mm
length:
14 mm
thermal resistance:
25.9 - 6.5 K/W
dissipation loss:
2.3 W
surface:
black anodised
Technical Drawing
Accessories / similar products
Product family accessory of product family:
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  • double-side adhesive thermal conductive foil with good thermal properties
  • coated carrier film with pressure-sensitive acrylate adhesive
  • curing of the adhesive layer can be influenced by temperature and time
  • serves as a substitute for mechanical connections
  • excellent adhesive properties on aluminium and ceramics
  • simple and secure attachment of e.g. heatsinks to electronic devices
  • designs as electrically conductive or electrically insulating thermal conductive foil
  • supplied in sheet and tape form, other forms on request
  • tape width (B) available in different dimensions and lengths
  • 24h sample delivery service for individual production according to customer drawing
  • customised cuts and contours according to drawing specifications
 
WLF:
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non isolations, double-sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

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