Thermal conductive paste and thermal interface film |
Thermal conductive paste
Thermal conductive paste and thermal interface film
WLP ...
WLP 500
- density:1.1 g/cm3
- temperature range:-40°C ... +250°C
material: | silicon thermal transfer compound
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composition: | silicone oil, inorganic filling material
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basin: | box
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specific electrical resistance: | >1012 Ω/cm
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flashpoint: | none (DIN 53213)
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drop point: | >260°C
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delivery quantity: | 500 g
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thermal resistance: | no bleeding at (4 h/200°C)
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acid number: | < 0.01 mg KOH/g
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consistance: | pastey
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colour: | white
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density: | 1.1 g/cm3
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thermal conductivity: | 0,61 W/m·K
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temperature range: | -40°C ... +250°C
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solubility in water: | insoluble
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FRI 7:30 - 15:15