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Heatsinks for PGA

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Heatsinks for PGA

ICK PGA 11 x 11

27,95 x 24,76 x 15,2 mm, for IC design PGA and others
Price on application
Quantity
Features
way of fixation:
  • therm. conductive foil
  • therm. cond. adhesive
socket:
universal
suitable for processor type:
universal
width:
27.95 mm
height:
15.24 mm
plate thickness:
3.5 mm
length:
24.76 mm
thermal resistance:
10.9 - 2.6 K/W
dissipation loss:
4.5 W
surface:
black anodised
Technical Drawing
Accessories / similar products
Product family accessory of product family:
11 - 12 (12)Number:
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  • one-sided adhesive thermal conductive foil
  • additional fiberglass reinforcement
  • high long-term and mechanical stability
  • easy handling and mounting
  • cuts and contours according to customer-specific drawing specifications
 
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silicone-free thermal transfer compound
 
11 - 12 (12)Number:
WLF:
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isolations, double sided adhesive
 
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non isolations, double-sided adhesive
 
Service
Drawing format (such as PDF, CAD)
Data sheet

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